Electronic carrier and method of manufacturing the same

An electronic carrier, comprising:

• a first interconnection structure comprising a first patterned conductive layer having a first pattern density;
• and
• a second interconnection structure disposed over the first interconnection structure and comprising a second patterned conductive layer having a second pattern density higher than the first pattern density;
• wherein the first interconnection structure is electrically connected to the second interconnection structure through a first non-soldering joint between and outside of the first interconnection structure and the second interconnection structure,
• wherein the first interconnection structure comprises a conductive portion including a wide part and a narrow part between the wide part and the first non-soldering joint, and the narrow part contacts the first non-soldering joint,
• wherein the narrow part has a width decreasing in toward the second interconnection structure,
• wherein a lateral surface of the narrow part comprises a curved surface,
• wherein the second interconnection structure comprises a conductive layer protruded beyond a surface of the second interconnection structure that faces the first interconnection structure,
• wherein a thickness of the narrow part is greater than a thickness of the conductive layer,
• wherein a portion of a bottom surface of the conductive layer is facing and exposed by the first non-soldering joint, and
• wherein in a cross-sectional view perspective, a portion of a top surface of the narrow part facing and exposed by the first non-soldering joint has a first width, and the portion of the bottom surface of the conductive layer exposed by the first non-soldering joint has a second width greater than the first width.