Semiconductor package structure

A semiconductor package structure, comprising:

• a first substrate having a first wiring structure;
• a second substrate having a second wiring structure, wherein the first substrate and the second substrate are arranged side-by-side, and the first substrate and the second substrate are surrounded and separated by a first molding material;
• a first semiconductor die disposed over the first substrate and electrically coupled to the first wiring structure;
• a second semiconductor die disposed over the second substrate and electrically coupled to the second wiring structure;
• a plurality of first antenna structures disposed over the first substrate and electrically coupled to the first wiring structure;
• and
• a plurality of second antenna structures disposed over the second substrate and electrically coupled to the second wiring structure.