Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths

A module comprising:

• a die having a bottom die surface with first pads, the first having a first area;
• second solder bumps disposed on the first pads;
• a layered structure comprising a first layer having a second pad, wherein the second pad has a second area greater than the first area and extends across a third lateral length overlapping the first pads, the first pads being coupled to the second pad by vias provides though the first layer;
• the layered structure comprising:
• a bottom surface extending in a first lateral direction and a second lateral direction perpendicular to the first lateral direction;
• a side surface extending in a vertical direction perpendicular to the first lateral direction and the second lateral direction;
• a first solder bump disposed on the bottom surface, wherein the first solder bump has a first lateral length in the first lateral direction and is disposed on a third pad, wherein the third pad is coupled to the second pad and the first lateral length is greater than a total of lateral lengths of the first pads;
• and
• a second solder bump disposed on the bottom surface, wherein the second solder bump has a second lateral length in the first lateral direction, wherein the first lateral length is greater than the second lateral length, wherein the second solder bump is adjacent to the side surface, and wherein the third lateral length is greater than the first lateral length.