Printed circuit board, power semiconductor module arrangement comprising a printed circuit board, and method for assembling the same

A method comprising:

• mechanically coupling one or more conductor rails to a printed circuit board;
• and
• arranging the printed circuit board with the one or more conductor rails mechanically coupled thereto in a housing of a power semiconductor module arrangement, wherein
• the printed circuit board comprises a dielectric insulation layer having a top side facing a first side and a bottom side opposite the first side that faces a second side of the dielectric insulation layer, and at least one conducting track formed on the dielectric insulation layer,
• the one or more conductor rails are coupled to the printed circuit board such that a first portion of each of the one or more conductor rails is arranged on the first side and a second portion of each of the one or more conductor rails is arranged on the second side of the dielectric insulation layer, and
• when the printed circuit board with the one or more conductor rails coupled thereto is arranged in the housing, a second end of each of the one or more conductor rails extends to the outside of the housing, and the method further comprises electrically and mechanically coupling a first end of each of the one or more conductor rails to the substrate.