Semiconductor package
OwnerTien-Chien Chenginventor
Life of this patent
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Abstract
A semiconductor package is disclosed for efficiently facilitating heat dissipation. The semiconductor package includes a substrate layer, a chip, a housing lid and thermal-conductive liquid. A chip is disposed on the substrate layer and electrically coupled to the substrate layer. The chip includes at least one through silicon via (TSV). The housing lid is disposed above both the substrate layer and the chip. Also, the housing lid is coupled to the substrate layer at its edge for forming an internal space that encompasses the chip. The thermal-conductive liquid is filled within the internal space.
Claims20
A semiconductor package, comprising:
- a substrate layer;
- a chip, disposed on the substrate layer and electrically coupled to the substrate layer, wherein the chip comprises at least one through silicon via (TSV);
- a housing lid, disposed above both the substrate layer and the chip, and coupled to the substrate layer at its edge for forming an internal space that encompasses the chip;
- and
- thermal-conductive liquid, filled within the internal space;
- wherein two of the at least one TSV are configured to form a pipe that embeds within the chip, and the two TSVs are substantially connected to each other.
A semiconductor package, comprising:
- a substrate layer;
- a chip, disposed on the substrate layer and electrically coupled to the substrate layer, wherein the chip comprises at least one through silicon via (TSV);
- a housing lid, disposed above both the substrate layer and the chip, and coupled to the substrate layer at its edge for forming an internal space that encompasses the chip;
- thermal-conductive liquid, filled within the internal space;
- and
- at least one microchannel disposed between two of the at least one TSV on a surface of the chip.
Dependencies are inferred from the claim text.