Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof

A method for manufacturing a circuit prearranged heat dissipation embedded packaging structure, the method comprising:

• prefabricating a support frame, wherein the support frame comprises a via pillar passing through the support frame in a height direction, a first wiring layer on a first surface of the support frame, and a through cavity surrounded by the support frame, the first wiring layer being embedded in the support frame, and the outer surface of the first wiring layer being flush with the first surface of the support frame, and the first wiring layer being in conductive connection with the via pillar;
• installing a chip in the through cavity so that a back face of the chip faces the first surface, and completely fills a gap between the chip and the frame with a dielectric material;
• forming a heat dissipation layer on the back face of the chip, and enabling the heat dissipation layer to be in conductive connection with the first wiring layer;
• and
• forming a second wiring layer on a terminal face of the chip, wherein the second wiring layer is in conductive connection with the first wiring layer through the via pillar.