Heat dissipation structure, manufacturing method for heat dissipation structure, and electronic apparatus
AssigneeLenovo (Singapore) Pte. Ltd.
InventorsMasahiro Kitamura, Takuroh Kamimura, Junki Hashiba, Takateru Adachi
Life of this patent
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Abstract
A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.
Claims9
A heat dissipation structure of an electric component that generates heat, the heat dissipation structure comprising:
- a semiconductor chip that includes a substrate, a die disposed on a surface of the substrate, and one or more electric elements disposed on the surface of the substrate, where the electric component is the die;
- a heat dissipator provided along a surface of the electric component;
- a liquid metal interposed between the electric component and the heat dissipator;
- and
- a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal,
- wherein the fencing body has an exhaust gap that is open laterally along a plane parallel to the surface of the substrate,
- wherein the exhaust gap is located in an angular range that is half of a maximum angular interval of the one or more electric elements with respect to a center of the die along the plane parallel to the surface of the substrate.
A manufacturing method for a heat dissipation structure of an electric component that generates heat, the manufacturing method comprising:
- a grease application step of applying a grease to a peripheral part of a surface of the electric component, where
- a semiconductor chip includes a substrate and a die and the electric component is the die, and
- the grease includes an exhaust gap on the surface of the electric component that is open laterally;
- a liquid metal application step of applying a liquid metal to an area of the surface of the electric component surrounded by the grease;
- and
- a heat dissipator contact step of pressing a heat dissipator against the surface of the electric component to bring the liquid metal into contact with the heat dissipator while crushing the grease, where
- excess air is discharged through the exhaust gap during the heat dissipator contact step,
- wherein one or more electric elements are provided on the substrate, and
- wherein the exhaust gap is located in a range in which an angular interval of the one or more electric elements with respect to a center of the die is largest.
Dependencies are inferred from the claim text.