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US 12,002,732 B2Granted
Copper/ceramic assembly, insulated circuit board, method for producing copper/ceramic assembly, and method for producing insulated circuit board
AssigneeMitsubishi Materials Corporation
InventorNobuyuki Terasaki
Life of this patent
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Abstract
This A copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of oxygen-containing ceramics, wherein the copper member and the ceramic member are bonded to each other, a magnesium oxide layer is formed on a ceramic member side between the copper member and the ceramic member, and an active metal oxide phase composed of an oxide of one or more active metals selected from Ti, Zr, Nb, and Hf is dispersed inside a copper layer in contact with the magnesium oxide layer.
Claims20
A copper/ceramic bonded body comprising:
- a copper member made of copper or a copper alloy;
- and
- a ceramic member made of oxygen-containing ceramics,
- wherein the copper member and the ceramic member are bonded to each other,
- a magnesium oxide layer is formed on a ceramic member side between the copper member and the ceramic member, and
- an active metal oxide phase composed of an oxide of one or more active metals selected from Ti, Zr, Nb, and Hf is dispersed inside a copper layer in contact with the magnesium oxide layer.
3 more elements
An insulating circuit substrate comprising:
- a copper sheet made of copper or a copper alloy;
- and
- a ceramic substrate made of oxygen-containing ceramics,
- wherein the copper sheet is bonded to a surface of the ceramic substrate,
- a magnesium oxide layer is formed on a ceramic substrate side between the ceramic substrate and the copper sheet, and
- an active metal oxide phase composed of an oxide of one or more active metals selected from Ti, Zr, Nb, and Hf is dispersed inside a copper layer in contact with the magnesium oxide layer.
3 more elements
Dependencies are inferred from the claim text.