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US 12,002,731 B2Granted
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsAe-Nee Jang, In Hyo Hwang
Life of this patent
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Abstract
Provided is a semiconductor package including a stiffener. The semiconductor package comprises a circuit board, a semiconductor chip on the circuit board, and a stiffener around the semiconductor chip, wherein the stiffener includes a first metal layer, a core layer, and a second metal layer sequentially stacked.
Claims18
A semiconductor package comprising:
- a circuit board;
- a semiconductor chip on the circuit board;
- a stiffener around the semiconductor chip, the stiffener including a first metal layer, a core layer, and a second metal layer sequentially stacked;
- and
- an adhesive layer attaching an upper surface of the circuit board to a bottom surface of the stiffener,
- wherein, in a layout view, a first length of at least one of the first metal layer, the core layer, or the second metal layer, extending in a first direction, is longer than a width of the semiconductor chip in the first direction, and
- wherein, in a cross-sectional view, a thickness of the core layer is greater than a thickness of at least one of the first metal layer or the second metal layer.
4 more elements
A semiconductor package comprising:
- a circuit board;
- an interposer on an upper side of the circuit board;
- a first semiconductor chip on an upper side of the interposer;
- a second semiconductor chip on the upper side of the interposer, the second semiconductor chip isolated from direct contact with the first semiconductor chip;
- a stiffener around the interposer on the upper side of the circuit board, the stiffener including a first metal layer, a core layer, and a second metal layer sequentially stacked;
- and
- an adhesive layer attaching the upper surface of the circuit board to a bottom surface of the stiffener,
- wherein, in a layout view, a first length of at least one of the first metal layer, the core layer, or the second metal layer, extending in a first direction, is longer than at least one of a width of the first semiconductor chip in the first direction or a width of the second semiconductor chip in the first direction, and
- wherein, in a cross-sectional view, a thickness of the core layer is greater than a thickness of at least one of the first metal layer or the second metal layer.
6 more elements
A semiconductor package comprising:
- a circuit board including
- an insulating core,
- a first substrate pad exposed from a lower side of the insulating core, and
- a second substrate pad exposed from an upper side of the insulating core;
- a first bump on an upper side of the circuit board and connected to the second substrate pad;
- an interposer including
- a semiconductor film,
- a first interposer pad exposed from a lower side of the semiconductor film and connected to the first bump,
- an interlayer insulating film on an upper side of the semiconductor film, and
- a second interposer pad exposed from an upper side of the interlayer insulating film;
- a second bump on an upper side of the interposer and connected to the second interposer pad;
- a semiconductor chip including a chip pad connected to the second bump;
- a stiffener around the interposer on the upper side of the circuit board, the stiffener including a first metal layer, a core layer, and a second metal layer sequentially stacked;
- and
- an adhesive layer attaching a bottom surface of the stiffener to the upper surface of the circuit board,
- wherein, in a layout view, a first length of at least one of the first metal layer, the core layer, or the second metal layer, extending in a first direction, is longer than a width of the semiconductor chip in the first direction, and
- wherein, in a cross-sectional view, a thickness of the core layer is greater than a thickness of at least one of the first metal layer or the second metal layer.
14 more elements
Dependencies are inferred from the claim text.