Electronic package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYou-Lung Yen, Bernd Karl Appelt
Life of this patent
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Abstract
A electronic package and a method of manufacturing the same are provided. The electronic package includes an electronic component, a thermal spreading element, and an encapsulant. The electronic component has a first surface. The thermal spreading element is disposed over the electronic component and has a first surface facing the first surface of the electronic component. The encapsulant covers the electronic component and has a first surface closer to the first surface of the thermal spreading element than the first surface of the electronic component.
Claims18
An electronic package, comprising:
- an electronic component having a first surface and a second surface opposite to the first surface;
- a thermal spreading element disposed over the electronic component and having a first surface facing the first surface of the electronic component;
- and
- a first encapsulant covering the electronic component and having a first surface closer to the first surface of the thermal spreading element than the first surface of the electronic component, wherein the second surface of the electronic component is recessed with respect to a bottom surface of the thermal spreading element.
An electronic package, comprising:
- a thermal spreading element;
- a first electronic component attached to the thermal spreading element and including a plurality of first electrical connectors, wherein the first electrical connectors are protruded beyond a bottom surface of the first electronic component;
- an encapsulant encapsulating the first electronic component, wherein a surface of the encapsulant and an end surface of the first electrical connectors are substantially coplanar;
- and
- a second electronic component encapsulated by the encapsulant and including a plurality of second electrical connectors protruded beyond a bottom surface of the second electronic component,
- wherein a width of the first electrical connectors and a width of the second electrical connectors are different.
Dependencies are inferred from the claim text.