Method of fabricating semiconductor structure

A method of fabricating a semiconductor structure, comprising:

• providing a plurality of substrates stacked in a direction;
• attaching a package to one of the plurality of substrates;
• bonding the plurality of substrates through a plurality of electrical connectors;
• and
• attaching a lid to at least two top surfaces of the plurality of substrates through a plurality of first adhesives, wherein the lid is positioned laterally beside the plurality of electrical connectors.

A method of fabricating a semiconductor structure, comprising:

• attaching a package to a first side of a first substrate;
• providing a lid, wherein the lid comprises a ring part and a plurality of overhang parts;
• attaching a bottom surface of the ring part of the lid to the first side of the first substrate by a first adhesive;
• attaching a second side opposite to the first side of the first substrate to a second substrate through a plurality of electrical connectors;
• and
• attaching bottom surfaces of the plurality of overhang parts of the lid to the second substrate by a second adhesive, the plurality of overhang parts extending from corner sidewalls of the ring part toward the second substrate to cover corner sidewalls of the first substrate.