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US 12,002,700 B2Granted
Substrate bonding apparatus and method of manufacturing a semiconductor device
AssigneeKioxia Corporation
InventorSho Kawadahara
Life of this patent
Estimating the term…
Abstract
According to one embodiment, there is provided a substrate bonding apparatus including a first chuck stage and a second chuck stage. The first chuck stage includes a first electromagnetic force generation unit. The first chuck stage is chuckable for a first substrate. The second chuck stage includes a second electromagnetic force generation unit. The second electromagnetic force generation unit faces the first electromagnetic force generation unit. The second chuck stage is chuckable for a second substrate.
Claims17
A substrate bonding apparatus comprising:
- a first chuck stage including a first electromagnetic force generation unit, the first chuck stage being chuckable for a first substrate;
- and
- a second chuck stage including a second electromagnetic force generation unit, the second electromagnetic force generation unit facing the first electromagnetic force generation unit, the second chuck stage being chuckable for a second substrate.
Dependencies are inferred from the claim text.