US 12,002,699 B2 · Wafer pod transfer assembly

Abstract

A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Claims20

Dependent claims

A wafer pod transfer assembly, comprising:

a wafer pod port to receive a wafer pod;
a transfer axle coupled to the wafer pod port;
a shaft receiver;
a shaft coupled to the transfer axle and to the shaft receiver;
a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end opposite the first end;
a pin screw through the shaft receiver and through the shaft, wherein the pin screw abuts a side surface of the pin;
and
a pin buckle comprising a first loop and a second loop, wherein:
the pin buckle is coupled to the pin,
the first loop encircles the first end of the pin, and
the second loop encircles the second end of the pin.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/117,593Filed 6 Mar 2023 · continuation

Priority

23 Apr 2021

Published

US 2023/0207365 A129 Jun 2023

Granted

4 Jun 2024

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10P 72/3402
The wafers being stored in a carrier, involving loading and unloading: mechanical parts of transfer devices
H10P 72/7602
Using mechanical means, e.g. clamps or pinches: the wafers being placed on a robot blade or gripped by a gripper for conveyance
B65G 47/90
Feeding, transfer, or discharging devices of particular kinds or types: devices for picking-up and depositing articles or materials
H10P 72/12
Using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]: vertical boat type carrier whereby the substrates are…

Family

Application63/179,177Us provisional application · filed 23 Apr 2021

Application17/382,506Parent of this continuation · filed 22 Jul 2021

US 2023/0207365 A1Pre-grant publication · published 29 Jun 2023

US 11,600,506 B2Parent of this continuation

US 2022/0344191 A1Published application

US 12,002,699 B2This patent

From the US filing history. Foreign family members aren’t listed.

Wafer pod transfer assembly

Life of this patent

Wafer pod transfer assembly

Life of this patent

Abstract

Claims20