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US 12,002,690 B2Granted
System for fracturing a plurality of wafer assemblies
AssigneeSoitec
InventorsDidier Landru, Oleg Kononchuk, Nadia Ben Mohamed
Life of this patent
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AssigneeSoitec
InventorsDidier Landru, Oleg Kononchuk, Nadia Ben Mohamed
Estimating the term…
A system for fracturing a plurality of wafer assemblies, one of the wafers of each assembly comprising a plane of weakness and each assembly comprising a peripheral lateral groove comprises: a cradle for keeping the assemblies of the plurality of assemblies spaced apart and parallel to one another, along a storage axis; a separation device for applying separating forces in the peripheral groove of an assembly arranged in a fracture zone of the separating device, the separating force aiming to separate the wafers of the assembly from one another so as to initiate its fracture at the plane of weakness; and a drive device configured to move along the storage axis of the cradle opposite the separating device so as to successively place an assembly of the cradle in the fracture zone of the separation device.
A system for fracturing a plurality of wafer assemblies, one wafer of each assembly comprising an embrittlement plane and each assembly comprising a peripheral side groove, the system comprising:
A method for fracturing a plurality of assemblies of wafers disposed in a cradle, wherein the plurality of assemblies of wafers are kept spaced apart from and parallel to each other, one of the wafers of each assembly comprising an embrittlement plane and each assembly comprising a peripheral side groove, the method comprising the following steps:
Dependencies are inferred from the claim text.