System and methods for wafer drying

A system comprising:

• a first processing chamber;
• a nozzle to dispense a polymeric material onto a center location of a wafer with a plurality of high aspect ratio features at a surface of the wafer;
• a wafer holding mechanism configured to rotate the wafer while dispensing the polymeric material, the first processing chamber being configured to perform a soft baking or curing process to convert the polymeric material to a solid film;
• a second processing chamber;
• a transport system configured to robotically transport the wafer from the first processing chamber to the second processing chamber;
• a mechanical handling system configured to support the wafer within the second processing chamber;
• a fluid inlet into the second processing chamber;
• a fluid outlet out of the second processing chamber;
• and
• an interface circuit configured to apply a pressurization cycle, the pressurization cycle configured to pressurize a fluid in the second processing chamber to become a supercritical fluid, remove the solid film by the supercritical fluid;
• purge the supercritical fluid completely from the second processing chamber, and
• remove the wafer from the second processing chamber after depressurizing the second processing chamber and stopping the flow of the supercritical fluid to the second processing chamber.