Method for packaging chip

A method for packaging a chip, comprising:

• providing a baseplate formed with an open slot thereon penetrating through opposite sides of the baseplate;
• providing a release base material, wherein the release base material is bonded to a first side of the baseplate and covers the open slot;
• providing a first chip, wherein the first chip is mounted on the release base material at the position of the open slot;
• packaging a second side of the baseplate facing away from the release base material so as to form a packaging layer which packages the first chip to be fixed on the baseplate;
• and
• removing the release base material to obtain a package structure for the first chip;
• wherein the providing the first chip further comprises mounting the first chip on the release base material in a manner in which pins thereon face the release base material, mounting a second chip on the first chip in a manner in which pins thereon face away from the release base material, wherein the pins of the second chip are conducted to the baseplate through respective leads;
• wherein the packaging the second side of the baseplate further comprises, packaging the first chip, the second chip and the leads of the second chip and fixing all on the baseplate;
• and
• the method further comprises after removing the release base material, conducting the pins of the first chip to the baseplate through leads, and packaging the first chip and its pins from the first side of the baseplate.