Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

A substrate processing system, comprising:

• a processing chamber comprising:
• a top plate having an array of process station openings disposed therethrough surrounding a central axis, wherein the top plate comprises a top plurality of sides;
• a bottom plate having a first central opening, wherein the bottom plate comprises a bottom plurality of sides;
• and
• a plurality of side walls between the top plate and the bottom plate;
• a plurality of heaters disposed in the top plate and the bottom plate and configured in a plurality of regions, wherein the plurality of heaters comprises a plurality of upper pairs of heaters disposed in the top plurality of sides and a plurality of lower pairs of heaters disposed in the bottom plurality of sides, wherein the upper pairs of heaters are disposed between adjacent openings of the array of process station openings;
• a cooling plate surrounding the first central opening having a first cooling channel disposed in the cooling plate;
• at least one second cooling channel disposed in the bottom plate, wherein the at least one second cooling channel is fluidly coupled to the first cooling channel and extends towards at least one side of the bottom plurality of sides;
• and
• a system controller configured to independently control the plurality of heaters in each region in the top plate and the bottom plate.