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US 12,002,667 B2Granted
Sputtering apparatus and method of controlling sputtering apparatus
AssigneeTokyo Electron Limited
InventorsMasato Shinada, Tetsuya Miyashita, Einstein Noel Abarra
Life of this patent
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Abstract
There is provided a sputtering apparatus comprising: a target from which sputtered particles are emitted; a substrate support configured to support a substrate; a substrate moving mechanism configured to move the substrate in one direction; and a shielding member disposed between the target and the substrate support and having an opening through which the sputtered particles pass. The shielding member includes a first shielding member and a second shielding member disposed in a vertical direction.
Claims13
A sputtering apparatus comprising:
- a processing chamber including:
- a chamber main body with an open upper portion;
- and
- a cover provided to close the open upper portion of the chamber main body;
- a target from which sputtered particles are emitted;
- a substrate support configured to support a substrate;
- a substrate moving mechanism configured to move the substrate in horizontal direction;
- a shielding member disposed between the target and the substrate support and having an opening through which the sputtered particles pass,
- wherein the shielding member includes a first shielding member, a second shielding member, and a third shielding member, the first shielding member arranged over the second shielding member, the second shielding member arranged over the third shielding member, and the third shielding member being apart from the substrate, and
- wherein an edge portion of the third shielding member is fixed to a side wall of the chamber main body;
- a target holder fixed on the cover, wherein the target holder holds the target on a front side of the target holder;
- a magnet disposed on a back side of the target holder and configured to reciprocate;
- a first driver configured to drive the first shielding member in horizontal direction;
- and
- a second driver configured to rotate the second shielding member, the second shielding member having a plate shape and rotating horizontally about an axis which is perpendicular to a top surface of the second shielding member.
12 more elements
A method of controlling a sputtering apparatus which includes:
- a processing chamber including:
- a chamber main body with an open upper portion;
- and
- a cover provided to close the open upper portion of the chamber main body;
- a target from which sputtered particles are emitted;
- a substrate support configured to support a substrate;
- a substrate moving mechanism configured to slide the substrate in horizontal direction;
- a shielding member disposed between the target and the substrate support, having an opening through which the sputtered particles pass, and including a first shielding member, a second shielding member, and a third shielding member, the first shielding member arranged over the second shielding member, the second shielding member arranged over the third shielding member, and the third shielding member being apart from the substrate,
- wherein an edge portion of the third shielding member is fixed to a side wall of the chamber main body;
- a target holder fixed on the cover, wherein the target holder holds the target on a front side of the target holder;
- a magnet disposed on a back side of the target holder and configured to reciprocate;
- a first driver configured to drive the first shielding member in horizontal direction;
- and
- a second driver configured to rotate the second shielding member, the second shielding member having a plate shape and rotating horizontally about an axis which is perpendicular to a top surface of the second shielding member,
- wherein the method comprises controlling the driver based on progress of consumption of the target.
12 more elements
Dependencies are inferred from the claim text.