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US 12,002,657 B2Granted
Multi-layer plasma resistant coating by atomic layer deposition
AssigneeApplied Materials, Inc.
InventorsXiaowei Wu, David Fenwick, Jennifer Y. Sun, Guodong Zhan
Life of this patent
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Abstract
Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of an article using an atomic layer deposition (ALD) process. The plasma resistant coating has a first layer and a second layer including a solid solution of Y2O3—ZrO2 and uniformly covers features, such as those having an aspect ratio of length to width of about 3:1 to about 300:1.
Claims10
An article comprising:
- a body;
- and
- a plasma resistant coating on a surface of at least a portion of the body, wherein the plasma resistant coating comprises:
- a stress relief layer having a thickness of about 10 nm to about 1.5 μm;
- and
- a stack of alternating layers of a rare earth metal-containing oxide and a second oxide, the stack of alternating layers comprising:
- a plurality of layers of the rare earth metal-containing oxide each having a thickness of about 1 angstrom to about 100 angstroms and having a polycrystalline or amorphous structure;
- and
- a plurality of layers of the second oxide each having a thickness of about 0.5 angstroms to about 4 angstroms,
- wherein the rare earth metal-containing oxide naturally occurs in a crystalline structure, wherein the plurality of layers of the second oxide cause the plurality of layers of the rare earth metal-containing oxide to have the polycrystalline or amorphous structure rather than the crystalline structure, and wherein a thickness ratio of the plurality of layers of the rare earth metal-containing oxide to the plurality of layers of the second oxide is 2:1 to 25:1.
7 more elements
Dependencies are inferred from the claim text.