Ceramic electronic device and manufacturing method of the same

A manufacturing method of a ceramic electronic device comprising:

• forming an electrode pattern of metal conductive paste on each of a plurality of green sheets that include, as a main component, ceramic particles of (Ba1-x-yCaxSry)(Ti1-zZrz)O3 (0<x≤0.2, 0≤y≤0.1, 0≤z≤0.1);
• thereafter, on each of the plurality of green sheets on which the electrode pattern has been formed, forming a first pattern around the electrode pattern, the first pattern including, as a main component, ceramic particles of (Ba1-x-yCaxSry)(Ti1-zZrz)O3 (0<x≤0.2, 0≤y≤0.1, 0≤z≤0.1);
• stacking the plurality of green sheets on which the electrode pattern and the first pattern have been formed to form a multilayer structure such that the first patterns are alternately shifted in lateral positions;
• and
• firing the multilayer structure, thereby converting the respective ceramic particles to corresponding ceramic grains, respectively,
• wherein an average grain diameter D3 of the ceramic grains in the first pattern after the firing is smaller than an average grain diameter D1 of the ceramic grains in the plurality of green sheets after the firing in a section sandwiched by, and next to, two adjacent electrode patterns, and
• wherein an average grain diameter D2 of the ceramic grains in the plurality of green sheets in a section corresponding to the first pattern in lateral position is greater than the average grain diameter D1, thereby satisfying D3<D1<D2.