Low temperature low-abundance atomic object dispenser

A dispenser for dispensing atomic objects, the dispenser comprising:

• an oven, the oven comprising oven walls defining a tube, a base cap closing off one end of the tube, and an aperture cap at least partially closing off an opposite end of the tube, the oven walls, base cap, and aperture cap defining a crucible chamber of the oven, the oven further comprising a depositing surface located within the crucible chamber;
• and
• a heating component configured to heat a composition comprising the atomic objects within the oven,
• wherein:
• a temperature of the depositing surface is controlled when the heating component heats the composition comprising the atomic objects to an atomizing reaction temperature to cause an atomizing chemical reaction to occur, wherein (a) a result of the atomizing chemical reaction is elemental atomic objects deposited on the depositing surface, and (b) the atomizing reaction temperature is greater than a dispensing threshold temperature, and
• the heating component is configured to allow the oven to cool after the atomizing chemical reaction is performed and then heat the oven to a dispensing temperature to cause the elemental atomic objects to be dispensed from the oven through a dispensing aperture in the aperture cap, wherein the dispensing temperature is less than or equal to the dispensing threshold temperature.

A method for dispensing atomic objects, the method comprising:

• sealing a reaction component at least partially coated with a composition comprising the atomic objects inside an oven with the oven disposed within a pressure-controlled chamber;
• with the oven disposed within the pressure-controlled chamber, heating the composition comprising the atomic objects to an atomizing reaction temperature to cause an atomizing chemical reaction to occur, wherein (a) the reaction component comprises a material that is a participant in the atomizing chemical reaction, (b) a result of the atomizing chemical reaction is elemental atomic objects deposited on a depositing surface within the oven, and (c) the atomizing reaction temperature is greater than a dispensing threshold temperature;
• and
• cooling the oven to at least the dispensing threshold temperature.