Multi-die integrated circuit with data processing engine array

A multi-die integrated circuit, comprising:

• a package substrate;
• one or more interconnect bridge dies coupled to the package substrate;
• a die coupled to the package substrate and the one or more interconnect bridge dies, wherein the die includes a first data processing engine (DPE) array and a second DPE array;
• wherein the first DPE array includes a first plurality of DPEs and a first DPE interface coupled to the first plurality of DPEs;
• wherein the second DPE array includes a second plurality of DPEs and a second DPE interface coupled to the second plurality of DPEs;
• and
• one or more other dies having a first die interface coupled to, and configured to communicate with, the first DPE interface via the one or more interconnect bridge dies and a second die interface coupled to, and configured to communicate with, the second DPE interface via the one or more interconnect bridge dies.