Backlight module, manufacturing method thereof, and liquid crystal display device

A manufacturing method of a backlight module, comprising:

• providing a substrate, and fabricating a reflective layer with a hollowed-out region on the substrate;
• and
• electrically connecting a light-emitting chip to the substrate in the hollowed-out region,
• wherein a projection of an edge of the hollowed-out region on the substrate is at least partially positioned within a coverage of a projection of the light-emitting chip on the substrate, and the light-emitting chip comprises a chip body and a pin layer electrically connected to the chip body, a top surface of the reflective layer is located below the bottom surface of the chip body, a surface of the substrate is disposed with a pad layer, and the pin layer is electrically connected to the pad layer through a conductive layer in the hollowed-out region, a distance between a projection of any one of the conductive layer or the pin layer on the substrate and the projection of the edge of the hollowed-out region on the substrate is greater than a third predetermined value, the pin layer comprises a first pin and a second pin, the conductive layer comprises a first conductor and a second conductor, and any one of the first conductor, the second conductor, the first pin, and the second pin are spaced from the reflective layer.

A liquid crystal display device, comprising:

• a liquid crystal display panel and a backlight module;
• wherein the backlight module comprises a substrate and a light-emitting chip and a reflective layer disposed on the substrate, the reflective layer comprises a hollowed-out region, the light-emitting chip is electrically connected to the substrate in the hollowed-out region, and a projection of an edge of the hollowed-out region on the substrate is at least partially positioned within a coverage of a projection of the light-emitting chip on the substrate, and the light-emitting chip comprises a chip body and a pin layer electrically connected to the chip body, a top surface of the reflective layer is located below the bottom surface of the chip body, a surface of the substrate is disposed with a pad layer, and the pin layer is electrically connected to the pad layer through a conductive layer in the hollowed-out region, a distance between a projection of any one of the conductive layer or the pin layer on the substrate and the projection of the edge of the hollowed-out region on the substrate is greater than a third predetermined value, the pin layer comprises a first pin and a second pin, the conductive layer comprises a first conductor and a second conductor, and any one of the first conductor, the second conductor, the first pin, and the second pin are spaced from the reflective layer.