Missile comprising electronics and a jumping-drop vapour chamber
AssigneeMbda UK Limited
InventorsDavid John Richard Hayes, Richard William Cronk
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Abstract
There is disclosed a missile comprising an outer skin, an electronics unit, and a thermal link between the electronics unit and the outer skin. The thermal link comprises a jumping drop vapour chamber arranged such that, when the outer skin is at an elevated temperature relative to the electronics unit, the electronics unit is thermally insulated from the outer skin; and such that, when the outer skin is at a lower temperature relative to the electronics unit, the electronics unit is thermally linked to the outer skin.
Claims15
A missile comprising an outer skin, an electronics unit, the electronics unit comprising one or more electronic components and an outer enclosure, the missile further comprising a thermal link between the one or more electronic components and the outer skin, wherein the thermal link comprises a jumping drop vapour chamber arranged such that, when the outer skin is at an elevated temperature relative to the one or more electronic components, the one or more electronic components are thermally insulated from the outer skin;
- and such that, when the outer skin is at a lower temperature relative to the one or more electronic components, the electronic components are thermally linked to the outer skin, and the missile further comprising a thermal gap pad located between the jumping drop vapour chamber and the outer skin.
A missile comprising an outer skin, an electronics unit, the electronics unit comprising one or more electronic components and an outer enclosure, and the missile further comprising a thermal link between the one or more electronic components and the outer skin, wherein the thermal link comprises a jumping drop vapour chamber arranged such that, when the outer skin is at an elevated temperature relative to the one or more electronic components, the one or more electronic components are thermally insulated from the outer skin;
- and such that, when the outer skin is at a lower temperature relative to the one or more electronic components, the electronic components are thermally linked to the outer skin, wherein the jumping drop vapour chamber comprises a first, condensing surface, and a second, evaporating surface;
- the first and second surfaces being generally parallel;
- the first surface being in thermal communication with the outer skin, and the second surface being in thermal communication with the one or more electronic components and wherein the jumping drop vapour chamber comprises a thermally insulating wall, which wall, in combination with the first and second surfaces, defines a chamber of the jumping drop vapour chamber, and wherein the wall is mechanically resilient.
A missile comprising an outer skin, an electronics unit, the electronics unit comprising one or more electronic components and an outer enclosure, and the missile further comprising a thermal link between the one or more electronic components and the outer skin, wherein the thermal link comprises a jumping drop vapour chamber arranged such that, when the outer skin is at an elevated temperature relative to the one or more electronic components, the one or more electronic components are thermally insulated from the outer skin;
- and such that, when the outer skin is at a lower temperature relative to the one or more electronic components, the electronic components are thermally linked to the outer skin, wherein the jumping drop vapour chamber is provided within a mechanical fastening.
Dependencies are inferred from the claim text.