Systems and methods for reducing vibration of apparatuses

A method, comprising:

• attaching a first weight to a first external surface of a semiconductor manufacturing apparatus;
• attaching a second weight to a second external surface of the semiconductor manufacturing apparatus, the second external surface being opposite to the first external surface and the first external surface and the second external surface forming opposite lateral walls of the semiconductor manufacturing apparatus;
• measuring vibration levels in portions of the semiconductor manufacturing apparatus having the first weight and the second weight;
• and
• increasing the first weight and the second weight when the vibration levels are greater than a predetermined level.

Semiconductor manufacturing apparatus, comprising:

• a first lateral wall;
• a second lateral wall opposite the first lateral wall, the first lateral wall and the second lateral wall forming external surfaces of the semiconductor manufacturing apparatus;
• and
• one or more weights each attached to the external surfaces formed by the first lateral wall and the second lateral wall, wherein the weights are attached on locations on the semiconductor manufacturing apparatus that maximize a reduction in vibrations of the semiconductor manufacturing apparatus at those locations.