Etching solution and application thereof
AssigneePhichem Corporation
InventorsXiaoyi Gao, Hangjian Hu
Life of this patent
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Abstract
The present disclosure relates to the technical field of etching. More specifically, the present disclosure relates to an etching solution and an application thereof. A preparation raw material of the etching solution includes at least one oxidant, at least one stabilizer, and deionized water. Through the combined action of hydrogen peroxide and stabilizer, the etching solution of the present disclosure has the good stability, the longer service life, the faster etching rate and the better stability of the etching rate, and the etching solution of the present disclosure has a good etching effect on a titanium-series metal.
Claims13
An etching solution, wherein a preparation raw material of the etching solution comprises at least one oxidant, deionized water, and the following stabilizer:
- stabilizer A:
- an inorganic phosphate, the phosphate radical in the stabilizer A accounts for 3.5-6.5 wt % of the etching solution;
- stabilizer B:
- an organic phosphonic acid and salts thereof;
- stabilizer C:
- an organic poly-carboxylic acid and salts thereof;
- the oxidant is selected from one of hydrogen peroxide, ammonium persulfate, or potassium persulfate;
- the weight ratio of the stabilizer C and the stabilizer B in the etching solution is (3-6):1.
Dependencies are inferred from the claim text.