Two-dimensional material printer and transfer system and method for atomically layered materials
AssigneeThe George Washington University
InventorsRohit Anil Hemnani, Volker J. Sorger
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AssigneeThe George Washington University
InventorsRohit Anil Hemnani, Volker J. Sorger
Estimating the term…
Precision and chip contamination-free placement of two-dimensional (2D) material and van der Waals (VDW) layered materials accelerates both the study of fundamental properties and novel device functionality. The system transfers 2D materials utilizing a combination of a narrow transfer-stamper and viscoelastic and optically transparent film. Precise placement of individual 2D materials results in vanishing cross-contamination to the substrate. The 2D printer results in an aerial cross-contamination improvement of two to three orders of magnitude relative to state-of-the-art transfer methods from a source of average area sub um{circumflex over ( )}2. The transfer-stamper does not physically harm any micro/nanostructures preexisting on the target substrates receiving the 2D material such as, nanoelectronics, waveguides or micro-ring resonators. Such accurate and substrate-benign transfer method for 2D and VDW layered materials provides rapid device prototyping due to its high time-reduction, accuracy, and contamination-free process.
A material transfer system for transferring 2-dimensional (2D) material to or from a substrate, said system comprising:
A material transfer system for transferring 2-dimensional (2D) material to or from a substrate, said system comprising:
A material transfer system for transferring a flake from a first substrate to a second substrate, said system comprising:
Dependencies are inferred from the claim text.