Resin molding apparatus and method for producing resin molded product
AssigneeTowa Corporation
InventorsRyota Okamoto, Keita Mizuma
Life of this patent
Estimating the term…
Loading patent…
AssigneeTowa Corporation
InventorsRyota Okamoto, Keita Mizuma
Estimating the term…
A resin molding apparatus includes: a resin supply mechanism including a nozzle for ejecting liquid resin to a supply target; a resin collection unit including: a resin-receiving member configured to receive a portion of the liquid resin which portion has dropped from the nozzle; and a movement mechanism configured to cause the resin-receiving member to move in such a manner as to follow the nozzle while keeping the resin-receiving member under the nozzle; a mold die including an upper die and a lower die facing the upper die; a mold clamp mechanism configured to clamp the mold die with the supply target between the upper die and the lower die; and a control section configured to control at least respective operations of the resin supply mechanism and the resin collection unit.
A resin molding apparatus, comprising:
Dependencies are inferred from the claim text.