Fast-curing molding process for epoxy resin based on electromagnetic induction heating
AssigneeHuazhong University of Science and Technology
InventorsRenfu Li, Yichao Li, Ao Sun, Jiaji Sun
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AssigneeHuazhong University of Science and Technology
InventorsRenfu Li, Yichao Li, Ao Sun, Jiaji Sun
Estimating the term…
The present invention provides a fast-curing molding process for epoxy resin. The method includes the following steps: S1, mixing epoxy resin A glue and a protein-grafted manganese-zinc-iron oxide nanomaterial well into a colloidal state, and grounding the mixture for 10 to 30 min; S2, adding epoxy resin B glue to the mixed colloid in S1, and performing ultrasonic dispersion at 20 to 30° C. for 10 to 30 min; and S3, placing the mixture obtained after ultrasonic dispersion in S2 in a vacuum environment for 20 to 40 min, then taking the mixture out and injecting the mixture into a mold, placing the mold and the mixed colloid into an electromagnetic induction heater, placing the electromagnetic induction heater in a magnetic field environment with a magnetic field intensity of 1 to 1.5 mT for 2 to 3 h, cooling and then taking them out to obtain the cured epoxy resin.
A fast-curing molding process for epoxy resin based on electromagnetic induction heating, comprising the following steps:
Dependencies are inferred from the claim text.