Laser cutting system

A system comprising:

• an emitting device adapted to emit a first laser beam and a second laser beam;
• a controller comprising one or more processors and operably coupled to the emitting device to control emission of the first and second laser beams, the controller adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device;
• and
• an optical sensor adapted to detect plasma illumination, wherein the controller is further adapted to:
• determine a position of a portion of a conductor positioned along the exposed surface of the workpiece based on plasma illumination emitted when the first laser beam contacts the conductor;
• and
• determine an angle relative to a normal to a major surface of the workpiece to emit the second laser beam based on the determined position of the portion of the conductor.