Soldering or sintering system with plurality of modules and temperature control

A soldering or sintering system for connecting electronic assemblies, comprising:

• a transport device for conveying the electronic assemblies through the system, comprising;
• a plurality of gas-tightly separable modules for connecting the electronic assemblies to one another, wherein at least one of the plurality of modules is designed as a soldering or sintering module and one of the plurality of modules is designed as a cooling module;
• vacuum insertable gate valves by which a separation of the gas-tightly separable modules is achieved, wherein a tightness of the vacuum insertable gate valves increases as the pressure increases and/or pressure equalization using the vacuum insertable gate valves takes place when the pressure is too high;
• a control for controlling the plurality of modules;
• between the at least one soldering or sintering module and the cooling module, a further module arranged that is designed as a mid-temperature-control module for controlled cooling from a process temperature of the at least one soldering or sintering module to an intermediate temperature below a solder solidification temperature, the mid-temperature-control module comprising a vacuum pump and a bleed valve configured to provide a positive pressure for a process atmosphere of 1 bar to 4.5 bar and a negative pressure of below 1 bar to vacuum;
• wherein in the mid-temperature-control module, a heating and a cooling device are comprised for controlled temperature adjustment and cooling down of the electronic assemblies from the process temperature of around 500° C. to the intermediate temperature below the solder solidification temperature, which is in the range from 220° C. to 150° C.;
• wherein in the mid-temperature-control module, a gas purging device for purging the electronic assemblies by cold gas comprising formic acid or nitrogen is comprised.