Increased MUT coupling efficiency and bandwidth via edge groove, virtual pivots, and free boundaries
AssigneeExo Imaging, Inc.
InventorsBrian Bircumshaw, Sandeep Akkaraju, Haesung Kwon
Life of this patent
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Abstract
Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.
Claims61
A micromachined ultrasonic transducer (MUT) comprising (i) a piezoelectric stack comprising a top electrode, a bottom electrode, and a piezoelectric layer disposed therebetween and (ii) a diaphragm disposed below the piezoelectric stack and comprising a groove that is disposed within the diaphragm and at least partially surrounds the piezoelectric stack.
A micromachined ultrasonic transducer (MUT) comprising:
- a substrate that forms a diaphragm, the diaphragm having a vertical thickness;
- one or more electrodes located on or near the diaphragm;
- and
- a groove cut into the diaphragm and at least partially surrounding the one or more electrodes, the groove having a depth that does not cut entirely through the vertical thickness of the diaphragm.
A micromachined ultrasonic transducer (MUT) comprising a piezoelectric stack and a substrate, the piezoelectric stack comprising a top electrode, a bottom electrode, and a piezoelectric layer disposed between the top and bottom electrodes, the substrate comprising an upper surface that supports the piezoelectric stack and a channel that extends into the substrate and at least partially surrounds the piezoelectric stack.
Dependencies are inferred from the claim text.