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US 11,998,397 B2Granted
Thermal conductive layer for transducer face temperature reduction
AssigneeFujifilm Sonosite, Inc.
InventorsWei Li, Keith Williams
Life of this patent
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Abstract
A method and apparatus are disclosed herein for a thermally conductive layer for transducer face temperature reduction in an ultrasound transducer assembly. In one embodiment, the ultrasound transducer assembly comprises: a transducer layer configured to emit ultrasound energy; one or more matching layers overlaying the transducer layer; a thermally conductive layer overlaying the one or more matching layers; and a lens overlaying the thermally conductive layer.
Claims18
An ultrasound transducer assembly comprising:
- a transducer layer configured to emit ultrasound energy;
- one or more matching layers on the transducer layer;
- a thermally conductive layer on the one or more matching layers;
- a backing layer including a channel to hold the transducer layer and outer sides coupled to the channel, wherein the thermally conductive layer is wrapped around the outer sides of the backing layer and is separated from the transducer layer by the backing layer,
- a first shield coupled to the thermally conductive layer at a first connection point on at least one of the outer sides of the backing layer, and
- a radio-interference (RFI) shield connected to the first shield at a second connection point on the at least one of the outer sides of the backing layer.
3 more elements
An ultrasound apparatus comprising:
- a display screen;
- an ultrasound imaging subsystem coupled to the display to generate ultrasound images on the display screen;
- an ultrasound control subsystem coupled to control the imaging subsystem;
- and
- an ultrasound transducer assembly comprising
- a transducer layer configured to emit ultrasound energy,
- one or more matching layers on the transducer layer,
- a thermally conductive layer on the one or more matching layers, and
- a backing layer including a channel to hold the transducer layer and outer sides coupled to the channel, wherein the thermally conductive layer is wrapped around the outer sides of the backing layer and is separated from the transducer layer by the backing layer;
- a first shield coupled to the thermally conductive layer at a first connection point on at least one of the outer sides of the backing layer;
- and
- a radio-interference (RFI) shield connected to the first shield at a second connection point on the at least one of the outer sides of the backing layer.
9 more elements
Dependencies are inferred from the claim text.