Technique to improve waterproofness and dust resistance for circuit board in job-site gear

A job-site gear comprising:

• a circuit board having a first surface and a second surface, wherein:
• the first surface includes a first area, a second area and a third area;
• the third area is between the first area and the second area;
• the second surface is behind the first surface;
• the second surface includes a fourth area, a fifth area, and a sixth area;
• the fourth area, the fifth area, and the sixth area are behind the first area, the second area, and the third area, respectively;
• and the third area and the sixth area include at least one slit penetrating through the circuit board;
• at least one electronic component mounted on the first area;
• and
• a resin member integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component,
• wherein the at least one slit has a semicircular arc shape.

A job-site gear comprising:

• a circuit board having a first surface and a second surface, wherein:
• the first surface includes a first area, a second area and a third area;
• the third area is between the first area and the second area;
• the second surface is behind the first surface;
• the second surface includes a fourth area, a fifth area, and a sixth area;
• the fourth area, the fifth area, and the sixth area are behind the first area, the second area, and the third area, respectively;
• and the third area and the sixth area include at least one slit penetrating through the circuit board;
• at least one electronic component mounted on the first area;
• and
• a resin member integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component,
• wherein the first area partially includes a first resist formed on the first surface,
• wherein the second area partially includes a second resist formed on the second surface,
• wherein the circuit board includes:
• a first adhesive joint (i) that is provided in the third area and (ii) that does not include the first resist provided thereon;
• and
• a second adhesive joint (i) that is provided in the sixth area and (ii) that does not include the second resist provided thereon, and
• wherein the resin member is adhered to the first adhesive joint and the second adhesive joint without interposing the first resist and the second resist therebetween.

A job-site gear comprising:

• a circuit board having a first surface and a second surface, wherein:
• the first surface includes a first area, a second area and a third area;
• the third area is between the first area and the second area;
• the second surface is behind the first surface;
• the second surface includes a fourth area, a fifth area, and a sixth area;
• the fourth area, the fifth area, and the sixth area are behind the first area, the second area, and the third area, respectively;
• and the third area and the sixth area include at least one slit penetrating through the circuit board;
• at least one electronic component mounted on the first area;
• and
• a resin member integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component,
• wherein the circuit board includes a non-adjacent end that is not on the third area,
• wherein the resin member includes a proximal end to the non-adjacent end, and
• wherein the job-site gear further includes a lead wire (i) that is electrically connected to the at least one electronic component, (ii) that has a portion covered with the resin member, and (iii) that protrudes from the proximal end.

A job-site gear comprising:

• a circuit board having a first surface and a second surface, wherein:
• the first surface includes a first area, a second area and a third area;
• the third area is between the first area and the second area;
• the second surface is behind the first surface;
• the second surface includes a fourth area, a fifth area, and a sixth area;
• the fourth area, the fifth area, and the sixth area are behind the first area, the second area, and the third area, respectively;
• and the third area and the sixth area include at least one slit penetrating through the circuit board;
• at least one electronic component mounted on the first area;
• and
• a resin member integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component,
• wherein the at least one electronic component includes a manual switch configured to be manually operated by a user of the job-site gear.

A job-site gear comprising:

• a circuit board having a first surface and a second surface, wherein:
• the first surface includes a first area, a second area and a third area;
• the third area is between the first area and the second area;
• the second surface is behind the first surface;
• the second surface includes a fourth area, a fifth area, and a sixth area;
• the fourth area, the fifth area, and the sixth area are behind the first area, the second area, and the third area, respectively;
• and the third area and the sixth area include at least one slit penetrating through the circuit board;
• at least one electronic component mounted on the first area;
• a resin member integrally molded so as to (i) penetrate through the at least one slit and (ii) cover the first area, the fourth area, and a part of the at least one electronic component;
• and
• a manual controller manually operated by a user of the job-site gear,
• wherein the circuit board and the resin member are provided to the manual controller.

A method for manufacturing a job-site gear, the method comprising:

• providing a circuit board having a first surface and a second surface, wherein:
• the first surface includes a first area, a second area and a third area;
• the third area is between the first area and the second area;
• the second surface is behind the first surface;
• the second surface includes a fourth area, a fifth area, and a sixth area;
• and the fourth area, the fifth area, and the sixth area are behind the first area, the second area, and the third area, respectively;
• mounting at least one electronic component on the first area;
• providing at least one slit in the third area and the sixth area, the at least one slit penetrating through the circuit board;
• integrally molding a resin member so that (i) the resin member penetrates through the at least one slit and (ii) the resin member covers the first area, the fourth area, and a part of the at least one electronic component with the second area and the fifth area extending out of the resin member such that the second area and the fifth area are not covered by the resin member;
• and
• providing to the job-site gear the circuit board with the resin member integrally molded.