Photosensitive module having transparent plate and image sensor

Abstract

A photosensitive module is provided, for receiving light passing through a lens in an electronic device, including a base assembly, a first plastic member, a first lead assembly, an image sensor, and an opening. The base assembly includes a substrate, an insulating layer, and a circuit layer. The substrate has a main body that includes a metal material. The first plastic member is connected to the base assembly. The first plastic member encapsulates at least part of the lead assembly. The image sensor is for receiving a light and is electrically connected to the circuit layer via the lead assembly. The opening is formed at the main body, and corresponds to the image sensor. When observed along a direction in which the light travels, the opening overlaps the image sensor.

Dependencies are inferred from the claim text.