Probe card with angled probe and wafer testing method using the same

A probe card, comprising:

• a fixing member having opposite first and second sidewalls defining a through opening therebetween;
• a circuit board laterally surrounding a top portion of the fixing member such that a bottom portion of the fixing member is below a bottom surface of the circuit board;
• and
• a plurality of probes connected to the circuit board, wherein each of the probes comprises:
• an arm portion extending from the circuit board, through the fixing member, to the through opening of the fixing member;
• and
• a tip portion connected to the arm portion,
• wherein extending directions of the tip portions of the probes are substantially the same and are inclined to a direction perpendicular to the first sidewall of the fixing member in a top view.

A method comprising:

• placing a wafer on a wafer holder, wherein the wafer has a plurality of testing pads, and the plurality of testing pads of the wafer are arranged along a first direction;
• moving a probe card toward the wafer, the probe card comprising:
• a circuit board;
• a fixing member having a through opening therein, wherein the through opening of the fixing member is defined at least partially by opposite first and second sidewalls;
• and
• a plurality of probes, each of the probes comprising:
• an arm portion, wherein one end of the arm portion is connected to the circuit board;
• and
• a tip portion extending from the arm portion;
• and
• aligning the tip portions of the probes with the plurality of testing pads such that sidewalls of the plurality of testing pads are substantially parallel to the first sidewall of the fixing member and are oblique to extending directions of the arm portions of the probes.