Test apparatus for semiconductor package

A test apparatus for a semiconductor package, comprising:

• a lower test socket mounted on a tester providing a test signal, and connected to a lower terminal of a lower package to electrically connect the lower package to the tester;
• a pusher configured to be able to be moved vertically by receiving a driving force from a driving unit;
• and
• an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package that is a defect-free package, to be electrically connected to a lower terminal of the upper package,
• wherein the lower terminal of the upper package is formed in the form of a solder ball, and a plating layer of oxidation-preventing metal is formed on an upper side of the lower terminal of the upper package which comes in direct contact with the electro-conductive part.

A test apparatus for a semiconductor package, comprising:

• a lower test socket mounted on a tester providing a test signal, and connected to a lower terminal of a lower package;
• a pusher configured to be able to be moved vertically;
• an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package to be electrically connected to a lower terminal of the upper package;
• a vacuum picker mounted on a center of the upper test socket;
• and
• an inelastic insulating sheet installed between the upper test socket and the upper package, the inelastic insulating sheet having a through hole formed at a position thereof corresponding to the terminal of the upper package and the electro-conductive part, and having a vacuum space part formed in a lower surface thereof corresponding to the upper test socket.