Testing device for integrated circuit package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShao-Chun Chiu, Wen-Feng Liao, Hao Chen, Chun-Hsing Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShao-Chun Chiu, Wen-Feng Liao, Hao Chen, Chun-Hsing Chen
Estimating the term…
A testing device for testing an integrated circuit package is provided, including a printed circuit board, a testing socket, a conductive fastener, a cover, and a conductive element assembly. The printed circuit board includes a first metal layer formed on the bottom surface thereof. The testing socket is disposed above the printed circuit board. The conductive fastener is configured to secure the testing socket to the printed circuit board, wherein the conductive fastener is electrically connected to the first metal layer and the testing socket. The cover is disposed above the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket, wherein the cover makes electrical contact with the integrated circuit package. The conductive element assembly is disposed between and electrically connected to the cover and the testing socket.
A testing device for testing an integrated circuit package, comprising:
A testing device for testing an integrated circuit package, comprising:
A testing device for testing an integrated circuit package, comprising:
Dependencies are inferred from the claim text.