Adhesive floor/wallboard and method of using same
AssigneeWellmade Floor Covering International, Inc.
InventorZhu Chen
Life of this patent
Estimating the term…
Abstract
An adhesive floor/wallboard includes a floor/wallboard main body layer and a buffer layer adhered to the back surface of the floor/wallboard main body layer. The buffer layer is provided with a plurality of holes. The holes extend through the buffer layer to the main body layer. Glue is deposited in the holes. The buffer layer is adhered to the back surface of the floor/wallboard. The glue in the holes makes direct contact with the floor/wallboard main body at the holes. Due to the holes and their depth, the contact area between the glue, the buffer layer and the main body is increased. Accordingly, the adhesive floor/wallboard can be more firmly adhered to a backing surface.
Claims13
An adhesive floor/wallboard comprising a floor/wallboard main body layer, and a buffer layer adhered to the back surface of the floor/wallboard main body layer, wherein the buffer layer is provided with a plurality of holes, the holes extend through the buffer layer to the main body layer, wherein a portion of the back surface of the floor/wallboard main body layer is not covered by the buffer layer, and wherein the buffer layer comprises irradiation cross-linked polyethylene (IXPE).
An adhesive floor/wallboard comprising a floor/wallboard main body layer, a buffer layer adhered to the back surface of the floor/wallboard main body layer, a self-adhesive layer, and a release paper layer,
- wherein the self-adhesive layer is adhered to the back surface of the buffer layer, and the release paper layer is adhered to the back surface of the self-adhesive layer,
- wherein the buffer layer, the self-adhesive layer, and the release paper layer are provided with a plurality of holes, the plurality of holes extend through the buffer layer, the self-adhesive layer, and the release paper layer all the way to the main body layer, and a portion of the back surface of the floor/wallboard main body layer is not covered by the buffer layer, and
- wherein the material of the buffer layer comprises irradiation cross-linked polyethylene (IXPE).
Dependencies are inferred from the claim text.