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US 11,993,851 B2Granted
Aqueous solution for surface treatment, method for producing surface-treated alloy, and composite and method for producing the same
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsTomoko Fujii, Kazuhiko Ikeda, Shun Fukazawa
Life of this patent
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Abstract
An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.
Claims21
An aqueous solution suitable for treating a surface of an alloy, the aqueous solution comprising:
- a copper compound at a copper ion concentration of 20000 ppm or more and 45000 ppm or less;
- a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less;
- and
- a halide at a halide ion concentration of 2000 ppm or more and 70000 ppm or less,
- wherein the heterocyclic nitrogen compound comprises pyrazole,
- wherein the copper compound comprises copper (II) sulfate and/or copper (II) bromide,
- wherein the halide comprises at least one selected from the group consisting of sodium chloride, potassium chloride, and potassium bromide, and
- wherein the aqueous solution is formulated such that copper is deposited on the surface of the alloy when the aqueous solution is contacted with the surface of the alloy.
5 more elements
Dependencies are inferred from the claim text.