Mask and method of manufacturing the same, and mask assembly

A method of manufacturing a mask, the mask having a mask pattern region and a non-mask pattern region located at a peripheral of the mask pattern region;

• the mask pattern region including at least one effective mask region;
• and the mask having at least one welding region in the non-mask region;
• the method comprising:
• forming a first metal layer, where the first metal layer extends from the mask pattern region to the non-mask pattern region, and covers the non-mask pattern region;
• and in any of the at least one effective mask region, the first metal layer includes a plurality of evaporation holes and at least one shielding strip, and each shielding strip is located between two adjacent evaporation holes;
• and
• forming a second metal layer on a side of the first metal layer, wherein the second metal layer is located in the non-mask pattern, and at least covers a portion of the first metal layer located in the at least one, welding region;
• and a thickness of a portion of the mask in the non-mask pattern region and at least in a welding region is greater than a thickness of the shielding strip of the mask in the at least one effective mask region,
• wherein forming a second metal layer on a side of the first metal layer, including:
• forming a first adhesive layer on a side of the first metal layer, wherein the first adhesive layer at least covers a portion of the first metal layer other than the evaporation holes in the mask pattern region;
• forming the second metal layer on the first metal layer on which the first adhesive layer has been formed through an electroforming process, wherein the second metal layer covers an exposed surface of the first metal layer in the non-mask pattern region;
• and
• removing the first adhesive layer,
• wherein forming a first adhesive layer on a side of the first metal layer, including:
• providing a mold on a side of the first metal layer, wherein the mold is located in the non-mask pattern region, and at least covers a transition region adjacent to the mask pattern region in the non-mask pattern region;
• a thickness of the mold in the transition region gradually increases from 0 to H along a first direction;
• a range of H is approximately 10 μm to approximately 27 μm;
• a width range of the transition region along the first direction is approximately 1 μm to approximately 3 μm;
• and the first direction points from a side of the transition region where the transition region is connected to the mask pattern region to a side of the transition region away from the mask pattern region;
• forming the first adhesive layer on the first metal layer on which the mold has been disposed, wherein the first adhesive layer includes:
• a main adhesive layer pattern covering the portion of the first metal layer other than the evaporation holes in the mask pattern region, and an extending adhesive layer pattern extending to the transition region;
• and the extending adhesive layer pattern covers a portion of the mold located in the transition region;
• and
• removing the mold and retaining the first adhesive layer.