Adhesive composition for semiconductor circuit connection and adhesive film containing the same
AssigneeLG Chem, Ltd.
InventorsJunghak Kim, You Jin Kyung, Kwang Joo Lee, Minsu Jeong, Ju Hyeon Kim, Youngsam Kim
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Abstract
The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.
Claims8
An adhesive composition for semiconductor circuit connection, comprising a thermosetting resin containing an organic epoxy resin and an organic-inorganic hybrid epoxy resin having a repeating unit represented by Chemical Formula 1, wherein a weight ratio of the organic epoxy resin to the organic-inorganic hybrid epoxy resin having a repeating unit represented by Chemical Formula 1 in the thermosetting resin is the range of 1:0.03 to 1:4.0,
- wherein the organic epoxy resin contains (a1) an organic epoxy resin that is solid at 10 to 35° C., and (a2) an organic epoxy resin that is liquid at 10 to 35° C.,
- wherein
- a weight ratio of (a1):[(a2)+(a3)] is 1:0.15 to 1:2.7, and
- a weight ratio of (a2):(a3) is 1:0.15 to 1:10,
- wherein (a3) is the organic-inorganic hybrid epoxy resin,
- wherein the adhesive composition further comprises a thermoplastic resin, a curing agent, an inorganic filler, and a curing catalyst,
- wherein the thermoplastic resin is a (meth)acrylate-based resin having a (meth)acrylate-based repeating unit containing an epoxy-based functional group,
- wherein the thermoplastic resin is included in an amount of 53 parts by weight to 70 parts by weight, the curing agent is included in an amount of 10 parts by weight to 150 parts by weight, the inorganic filler is included in an amount of 5 parts by weight to 200 parts by weight, and the curing agent catalyst is included in an amount of 0.1 to 20 parts by weight, based on 100 parts by weight of the thermosetting resin, and
- wherein the organic-inorganic hybrid epoxy resin has an average epoxy equivalent weight of 50 g/eq. to 174 g/eq.:
- in the Chemical Formula 1,
- R is each independently a monovalent functional group having at least one epoxy group, and
- n is 1 to 30.
Dependencies are inferred from the claim text.