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US 11,993,247 B2Granted
Intelligent power module, electric vehicle or hybrid vehicle, and method of assembling intelligent power module
AssigneeRohm Co., Ltd.
InventorHideki Sawada
Life of this patent
Estimating the term…
Abstract
An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.
Claims14
A power module device, comprising:
- a first heat radiation device including an integrated flow path, a front surface, and a rear surface;
- a plurality of power semiconductor modules disposed in a row over the front surface of the first heat radiation device and configured to individually seal a semiconductor device circuit;
- a second heat radiation device disposed over the plurality of power semiconductor modules;
- a drive circuit part configured to drive the plurality of power semiconductor modules and disposed over the second heat radiation device;
- a heat shield member placed between the plurality of power semiconductor modules and the drive circuit part;
- and
- an attachment frame, disposed on the front surface of the first heat radiation device, the attachment frame comprising:
- a frame body;
- and
- a plurality of holes formed inside the frame body,
- wherein the plurality of power semiconductor modules is mounted on the front surface of the first heat radiation device via respective ones of the plurality of holes,
- wherein the second heat radiation device is formed of a metal plate having a heat radiation property,
- wherein the metal plate is formed of Al, and
- wherein the second heat radiation device has a spring property.
11 more elements
A power module device, comprising:
- a first heat radiation device including an integrated flow path, a front surface, and a rear surface;
- a plurality of power semiconductor modules, each of the plurality of power semiconductor modules constituting a two-in-one module, the plurality of power semiconductor modules being disposed in a row over the front surface of the first heat radiation device and being configured to individually seal a semiconductor device circuit therein;
- a second heat radiation device disposed over the plurality of power semiconductor modules;
- a drive circuit part configured to drive the plurality of power semiconductor modules and disposed over the second heat radiation device;
- a heat shield member placed between the plurality of power semiconductor modules and the drive circuit part;
- and
- an attachment frame disposed on the front surface of the first heat radiation device, the attachment frame comprising:
- a frame body;
- and
- a plurality of holes formed inside the frame body,
- wherein the plurality of power semiconductor modules is mounted on the front surface of the first heat radiation device via respective ones of the plurality of holes,
- wherein the plurality of power semiconductor modules constitutes a six-in-one module type inverter or converter,
- wherein the second heat radiation device is formed of a metal plate having a heat radiation property,
- wherein the metal plate is formed of Al, and
- wherein the second heat radiation device has a spring property.
12 more elements
Dependencies are inferred from the claim text.