Chuck, lamination process, and manufacturing method of semiconductor package using the same

A lamination chuck, comprising

• a base comprising a threaded hole;
• a support layer disposed on the base, the support layer comprising a through hole;
• and
• a top layer disposed on the support layer,
• wherein the top layer and the support layer comprise at least one vacuum channel extending from a top surface of the top layer to a bottom surface of the support layer, and the at least one vacuum channel is in fluidic communications with the through hole,
• wherein the top layer comprises a hemicylindrical concavity located at an outer side edge of the top layer, the hemicylindrical concavity extends from the top surface of the top layer to a bottom surface of the top layer, and the hemicylindrical concavity substantially aligns to the through hole of the support layer as well as the threaded hole of the base.

A lamination chuck, comprising

• a base comprising a threaded hole;
• a support layer disposed on the base, the support layer comprising a through hole;
• and
• a top layer disposed on the support layer,
• wherein the top layer and the support layer comprise a plurality of vacuum channels extending from a top surface of the top layer to a bottom surface of the support layer, the plurality of vacuum channels are formed at a distance from each other as segments of a region extending along an outer side edge of the top layer, and the at least one vacuum channel is in fluidic communications with the through hole,
• wherein the top layer has a substantially circular outline having a first diameter, the region where the plurality of vacuum channels are distributed is an annular region having a second diameter as inner diameter, a ratio of the second diameter to the first diameter is in a range from 0.98 to 0.99, and the plurality of vacuum channels have an annular arc shape.