Workpiece processing device and method
AssigneeTokyo Seimitsu Co., Ltd.
InventorsTakahiro Iida, Teruhiko Nishikawa, Tasuku Shimizu
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Seimitsu Co., Ltd.
InventorsTakahiro Iida, Teruhiko Nishikawa, Tasuku Shimizu
Estimating the term…
A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.
A workpiece processing device for processing a workpiece having a central axis and having a cylindrical-shape surface, comprising:
Dependencies are inferred from the claim text.