Cooling system for electronic modules

A method for cooling a plurality of electronic devices housed in a housing of an electronic module, the method comprising:

• circulating a first coolant around a first cooling circulatory arrangement, comprising circulating the first coolant from a first coolant supply between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first coolant such that heat is transferred from the first electronic device to the first coolant;
• and
• circulating a second coolant around a second cooling circulatory arrangement, comprising circulating a second coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second coolant such that heat is transferred from the second electronic device to the second coolant;
• wherein the first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first coolant to the second coolant via the heat exchanger;
• and
• wherein the second cooling circulatory arrangement further comprises a second coolant supply, wherein the circulating the second coolant around the second cooling circulatory arrangement comprises receiving the second coolant from the second coolant supply, circulating the second coolant between the second electronic device of the plurality of electronic devices and the heat exchanger and to be returned to the second coolant supply.