Substrate fixing device
AssigneeShinko Electric Industries Co., Ltd.
InventorsHiroki Oguro, Yusuke Kinoshita, Yuichi Nakamura
Life of this patent
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Abstract
A substrate fixing device includes a baseplate, an electrostatic attraction member, and an electrode pin. The baseplate includes a metallic member in which a through hole is famed. The electrostatic attraction member is over a surface of the baseplate and includes an attraction electrode. The electrode pin is inserted through the through hole to be connected to the attraction electrode. A recess communicating with the through hole is formed in the surface of the metallic member with the through hole being within the recess in a plan view from a direction perpendicular to the surface of the metallic member.
Claims12
A substrate fixing device comprising:
- a baseplate including a metallic member in which a through hole is formed;
- an electrostatic attraction member over a surface of the metallic member, the electrostatic attraction member including an attraction electrode;
- and
- an electrode pin inserted through the through hole to be connected to the attraction electrode,
- wherein a recess communicating with the through hole is formed in the surface of the metallic member with the through hole being within the recess in a plan view from a direction perpendicular to the surface of the metallic member.
A substrate fixing device comprising:
- a baseplate including a metallic member in which a through hole is formed;
- a ceramic substrate over a surface of the metallic member, the ceramic substrate including an attraction electrode;
- and
- an electrode pin inserted through the through hole to be connected to the attraction electrode,
- wherein a recess enlarging the through hole open at a bottom of the recess is formed in the suffice of the metallic member, and
- a surface of the ceramic substrate facing the surface of the metallic member and facing toward the bottom of the recess is a flat surface.
Dependencies are inferred from the claim text.