Integrated circuit package with internal circuitry to detect external component parameters and parasitics

A method of parameter determination, comprising:

• coupling at least one of a resistance detector, an inductance detector, or a capacitance detector, internal to an integrated circuit (IC) package, to a pin of the IC package, the pin being coupled to a component external to the IC package;
• detecting, using the at least one of the resistance detector, the inductance detector, or the capacitance detector internal to the IC package, at least one of a resistance, an inductance, or a capacitance, respectively, of a lumped parameter model for the component external to the IC package and for parasitics associated with at least one of the component, the pin, or a connection between the component and the pin;
• and
• wherein detecting the capacitance comprises:
• closing a switch coupled between a current source and the pin at a beginning of a period to charge a capacitive element in the lumped parameter model with a current from the current source;
• opening the switch at an end of the period;
• sampling a voltage of the pin during the period with a sample-and-hold circuit;
• holding the sampled voltage at the end of the period with the sample-and-hold circuit;
• quantizing the held voltage with an analog-to-digital converter (ADC);
• and
• determining the capacitance of the capacitive element in the lumped parameter model based on a value of the current, a time length of the period, and the quantized voltage.