Apparatus and method for treating substrate

A substrate treating apparatus comprising:

• an index module including a container for storing a substrate;
• and
• a treating module configured to perform a process on the substrate, and
• wherein the treating module comprises:
• a buffer unit configured to temporarily store the substrate;
• a wet treating chamber configured to perform a developing process on the substrate by supplying a developing liquid;
• a supercritical treating chamber configured to treat the substrate by supplying a supercritical fluid;
• a heat-treating chamber configured to perform a heat treating process on the substrate;
• and
• a transfer chamber including a transfer unit configured to transfer the substrate between the wet treating chamber, the supercritical treating chamber, and the heat-treating chamber, and
• wherein the supercritical treating chamber comprises:
• a supply line configured to supply the supercritical fluid to a treating space therein;
• a heater installed on the supply line and configured to heat the treating fluid;
• an exhaust line configured to exhaust the treating space;
• and
• a controller configured to control the supply line and the exhaust as to supply and exhaust the treating fluid heated to and from the treating space, before a treating process is performed on the substrate in the treating space.

A substrate treating method comprising:

• a sealing step for sealing a treating space;
• after the sealing step, a pre-supply step for supplying and discharging a treating fluid to and from the treating space;
• after the pre-supply step, an introducing step for introducing the substrate to the treating space;
• after the introducing step, a substrate treating step for treating the substrate by supplying the treating fluid to the treating space;
• and
• after the substrate treating step, a taking out step for taking out the substrate from the treating space,
• wherein the substrate is not provided in the treating space in the pre-supply step.