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US 11,910,694 B2Granted
Vapor deposition method
AssigneeJapan Display Inc.
InventorShigeki Terada
Life of this patent
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Abstract
A vapor deposition method for depositing evaporated materials on a substrate using a mask includes arranging a mask frame and correcting a deflection of the mask frame in the direction of gravity after the mask frame is placed. The mask frame faces the substrate so that a first side is higher than a second side in a direction of gravity. The mask frame is provided with a mask and has the first side and the second side facing each other.
Claims11
A vapor deposition method for depositing evaporated materials on a substrate using a mask, the vapor deposition method comprising:
- arranging a mask frame facing the substrate so that a first side is higher than a second side in a direction of gravity, the mask frame being provided with a mask and having the first side and the second side facing each other;
- and
- correcting a deflection of the mask frame in the direction of gravity after the mask frame is placed using a correction mechanism including a first moving member, a second moving member located in contact with the mask frame, and a reduction mechanism moving the second moving member by a second displacement amount smaller than a first displacement amount when the first moving member moves by the first displacement amount.
Dependencies are inferred from the claim text.